Bonding Agent - Company Ranking(6 companies in total)
Last Updated： Aggregation Period:Sep 09, 2026〜Oct 06, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Argomax Product Lineup】 ■DAS: Die Attach ■TAS: Chip-on-Board Bonding ■PAS: Package Bonding ■WAS: Wafer-Level Sintering Adhesive *For more ... | Alpha Argomax sintering adhesive enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to impr... | ||
| **Argomax Sinter Paste** Alpha Argomax Sinter Paste enables the manufacturing of SiC GaN power module devices with a Tjmax of over 200°C, ... | Power semiconductors (including logic) Power discrete LED & laser Power modules High-power semiconductors, etc. They are particul... | ||
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セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
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- Featured Products
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McDarmid Power Electronics Argomax
- overview
- 【Argomax Product Lineup】 ■DAS: Die Attach ■TAS: Chip-on-Board Bonding ■PAS: Package Bonding ■WAS: Wafer-Level Sintering Adhesive *For more ...
- Application/Performance example
- Alpha Argomax sintering adhesive enables the manufacturing of SiC/GaN power modules/devices with a Tjmax of over 200°C, contributing to impr...
McDarmid Adhesives for Power Electronics
- overview
- **Argomax Sinter Paste** Alpha Argomax Sinter Paste enables the manufacturing of SiC GaN power module devices with a Tjmax of over 200°C, ...
- Application/Performance example
- Power semiconductors (including logic) Power discrete LED & laser Power modules High-power semiconductors, etc. They are particul...
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セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
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